The cause of the ever-increasing heat generation inside panel
The amount of heat generated inside panel continues to increase, and the temperature inside panel continues to rise proportionally.
Here we consider the causes of this.
Learn the basics of heat problems and how to solve them!
A 24-page resource focusing on thermal issues in panel.
Heat-related problems in panel and how to solve them
We will introduce you to the following.
Heat Densification
performance of control devices has improved dramatically, and with the increase in the number of electronic components such as semiconductors and capacitors mounted, and the diversification and miniaturization of integrated circuits and multi-layer boards, heat dissipation efficiency has not been able to keep up. This inevitably leads to an increase in heat density, and the control devices themselves are at risk of overheating.
High-speed and multi-axis production equipment
In pursuit of efficiency, there is a strong demand for shorter and faster production processes. To achieve this, high-performance CPU is required. To do this, the internal clock must be increased, and the processing speed must be further increased. As a result, the internal power consumption of the CPU increases further.
Furthermore, as production processes become more automated and multifunctional, the number of servo amplifiers and inverters used increases, resulting in an increase in the number of units used, which in turn increases the amount of heat generated.
Decrease in heat dissipation capacity due to downsizing of equipment/facilities/ panel
As electronic components and electrical circuits have become smaller in size along with high-performance, not only control devices but also the equipment itself has been downsized, and panel themselves are also beginning to be made smaller to improve space efficiency.Downsizing panel reduces the amount of heat dissipated from panel, resulting in heat being trapped inside.
Panel surface area and estimated internal temperature
The table below shows the estimated temperature inside the panel when the heat generated inside the panel is 1000W and the panel size is reduced.
As the panel surface area (= heat dissipation area) becomes smaller, the estimated internal temperature of the panel also increases.
| Panel surface area (5 sides excluding the bottom) |
11m2 （2×2×0.5） |
8.75m2 （2×1.5×0.5） |
6.5m2 （2×1×0.5） |
5m2 （1.5×1×0.5） |
3.5m2 （1×1×0.5） |
|---|---|---|---|---|---|
| Outside temperature = 35℃ Estimated internal temperature |
53.2℃ | 57.9℃ | 65.8℃ | 75.0℃ | 92.1℃ |
| Temperature difference with the outside air | ＋18.2℃ | ＋22.9℃ | ＋30.8℃ | ＋40.0℃ | ＋57.1℃ |
| Temperature difference based on 11m² | － | ＋4.7℃ | ＋12.6℃ | ＋21.8℃ | ＋38.9℃ |
*The above figures are calculated values and may not be the same as the actual results.
Quick explanation: How to calculate the estimated temperature rise inside the panel (guideline)
Note: This is just a guideline. Actual size may differ.
Rising ambient and outside temperatures due to densely packed facilities
In order to build or expand production facilities in a limited space, the only option is to place the facilities next to each other and eliminate wasted space. This reduces the airflow and ventilation efficiency around the adjacent facilities, and the ambient temperature rises, which reduces the amount of heat dissipated from panel and increases the amount of heat generated inside panel. The recent heat wave in the factory has exacerbated this problem.
Average temperature deviation in summer (June to August) for the world, Japan, and Tokyo (deviation from 1900)
Summer average temperature deviation
Source: Heatstroke environment Health Manual (created from data from the Japan Meteorological Agency, 5-year moving average)
Temperature changes inside panel where heat countermeasures are inadequate
The graph below shows the temperature change inside panel in a typical factory. Although control panel heat exchanger is installed, the temperature inside panel is still 15°C higher than the outside air temperature.
It's not surprising that you might experience heat problems at any time.
Changes in the temperature inside the power panel and the outside air temperature
Measuring equipment: Metal processing line for automotive parts (no air conditioning)
Heat protection for the board: Air-cooling type heat exchanger
panel Dimensions: H=2000, W=1000, D=500
Storage device: AC servo 3 axes and others
Measurement point: 1 point in the center of the board
Learn the basics of heat problems and how to solve them!
A 24-page resource focusing on thermal issues in panel.
Heat-related problems in panel and how to solve them
We will introduce you to the following.
